Summary form only given. A packaging scheme which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices.


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    Title :

    Opto-electronic packaging of 2-D surface active devices


    Contributors:

    Published in:

    Proceedings of LEOS'94 ; 1 ; 215-216 vol.1


    Publication date :

    1994-01-01


    Size :

    193082 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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