Summary form only given. A packaging scheme which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices.


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    Titel :

    Opto-electronic packaging of 2-D surface active devices


    Beteiligte:
    Basavanhally, N.R. (Autor:in) / Brady, M.F. (Autor:in) / Buchholz, D.B. (Autor:in)

    Erschienen in:

    Proceedings of LEOS'94 ; 1 ; 215-216 vol.1


    Erscheinungsdatum :

    01.01.1994


    Format / Umfang :

    193082 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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