Summary form only given. A packaging scheme which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices.
Opto-electronic packaging of 2-D surface active devices
Proceedings of LEOS'94 ; 1 ; 215-216 vol.1
01.01.1994
193082 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Opto-Electronic Packaging of 2-D Surface Active Devices
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