There is a dilemma in choosing between high density packaging and low loss transmission line. Though the LSI circuit and packaging become high density, the wiring on the printed wire board (PWB) becomes wider over 10 Gbit transmission. This paper introduces opto-electronics packaging techniques which aims to solve the problem of optical interconnection dilemma.


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    Titel :

    Opto-electronics packaging techniques for interconnection


    Beteiligte:
    Kurata, K. (Autor:in) / Hatakeyama, I. (Autor:in) / Miyoshi, K. (Autor:in) / Shimizu, T. (Autor:in) / Sasaki, J. (Autor:in) / Kurihara, M. (Autor:in) / Yamamoto, K. (Autor:in)


    Erscheinungsdatum :

    2003-01-01


    Format / Umfang :

    157422 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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