Summary form only given. In the present work, done with numerous collaborators at Bell Laboratories, we describe solutions to the fabrication problems in scaling up the hybrid CMOS technology to VLSI. The application to a high speed ATM switching fabric required 8704 micro solder bonds.
Solutions to the fabrication problems of hybrid optoelectronic VLSI CMOS chips
1996-01-01
526061 byte
Conference paper
Electronic Resource
English
Solutions to the Fabrication Problems of Hybrid Optoelectronic VLSI CMOS Chips
British Library Conference Proceedings | 1996
|Optoelectronic VLSI Circuit Fabrication
British Library Conference Proceedings | 1993
|ThDD6 32x32-bit Optoelectronic Database Filter based on CMOS Photonic VLSI Technology
British Library Conference Proceedings | 2002
|