Summary form only given. In the present work, done with numerous collaborators at Bell Laboratories, we describe solutions to the fabrication problems in scaling up the hybrid CMOS technology to VLSI. The application to a high speed ATM switching fabric required 8704 micro solder bonds.


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    Title :

    Solutions to the fabrication problems of hybrid optoelectronic VLSI CMOS chips


    Contributors:


    Publication date :

    1996-01-01


    Size :

    526061 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Solutions to the Fabrication Problems of Hybrid Optoelectronic VLSI CMOS Chips

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1996


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