Summary form only given. In the present work, done with numerous collaborators at Bell Laboratories, we describe solutions to the fabrication problems in scaling up the hybrid CMOS technology to VLSI. The application to a high speed ATM switching fabric required 8704 micro solder bonds.
Solutions to the fabrication problems of hybrid optoelectronic VLSI CMOS chips
01.01.1996
526061 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Solutions to the Fabrication Problems of Hybrid Optoelectronic VLSI CMOS Chips
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