In this paper, we present the use of three-dimensional planar-integrated free-space optics as an interconnection technique. This 3-D optics offers the potential to enter or remove many signals in parallel to/from a chip. This can solve one of the fundamental problems of electronic (actually, of any 2-D) interconnects. Furthermore, using specific components, signal fan-out can be rather easily implemented in contrast to other approaches.


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    Title :

    Planar-integrated free-space optics for interchip interconnects


    Contributors:
    Jahns, J. (author) / Gruber, M. (author) / Heming, R. (author) / Jarczynski, M. (author)


    Publication date :

    2005-01-01


    Size :

    904141 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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