In this paper, we present the use of three-dimensional planar-integrated free-space optics as an interconnection technique. This 3-D optics offers the potential to enter or remove many signals in parallel to/from a chip. This can solve one of the fundamental problems of electronic (actually, of any 2-D) interconnects. Furthermore, using specific components, signal fan-out can be rather easily implemented in contrast to other approaches.
Planar-integrated free-space optics for interchip interconnects
2005-01-01
904141 byte
Conference paper
Electronic Resource
English
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