In this paper, we present the use of three-dimensional planar-integrated free-space optics as an interconnection technique. This 3-D optics offers the potential to enter or remove many signals in parallel to/from a chip. This can solve one of the fundamental problems of electronic (actually, of any 2-D) interconnects. Furthermore, using specific components, signal fan-out can be rather easily implemented in contrast to other approaches.


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    Titel :

    Planar-integrated free-space optics for interchip interconnects


    Beteiligte:
    Jahns, J. (Autor:in) / Gruber, M. (Autor:in) / Heming, R. (Autor:in) / Jarczynski, M. (Autor:in)


    Erscheinungsdatum :

    01.01.2005


    Format / Umfang :

    904141 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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