We have made a thin flexible waveguide film for fully embedded board level optical interconnections. First, the master waveguide structures are formed on a silicon wafer using a standard photolithography process. Two 12-channel, 850 nm VCSEL arrays (2.5 Gb/s and 10 Gb/s) and a PIN photodiode array are used as I/O sources on a flexible polymeric waveguide film. The initial substrate thickness (200 /spl mu/m) of the VCSEL is reduced to facilitate thermal management of the VCSEL and the fully embedded structure.


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    Title :

    Performance evaluation of fully embedded board level optical interconnection


    Contributors:
    Jinho Choi, (author) / Li Wang, (author) / Xiaolong Wang, (author) / Hass, D. (author) / Magera, J. (author) / Chen, R.T. (author)


    Publication date :

    2004-01-01


    Size :

    183847 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




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