We have made a thin flexible waveguide film for fully embedded board level optical interconnections. First, the master waveguide structures are formed on a silicon wafer using a standard photolithography process. Two 12-channel, 850 nm VCSEL arrays (2.5 Gb/s and 10 Gb/s) and a PIN photodiode array are used as I/O sources on a flexible polymeric waveguide film. The initial substrate thickness (200 /spl mu/m) of the VCSEL is reduced to facilitate thermal management of the VCSEL and the fully embedded structure.
Performance evaluation of fully embedded board level optical interconnection
2004-01-01
183847 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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