We have made a thin flexible waveguide film for fully embedded board level optical interconnections. First, the master waveguide structures are formed on a silicon wafer using a standard photolithography process. Two 12-channel, 850 nm VCSEL arrays (2.5 Gb/s and 10 Gb/s) and a PIN photodiode array are used as I/O sources on a flexible polymeric waveguide film. The initial substrate thickness (200 /spl mu/m) of the VCSEL is reduced to facilitate thermal management of the VCSEL and the fully embedded structure.


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    Titel :

    Performance evaluation of fully embedded board level optical interconnection


    Beteiligte:
    Jinho Choi, (Autor:in) / Li Wang, (Autor:in) / Xiaolong Wang, (Autor:in) / Hass, D. (Autor:in) / Magera, J. (Autor:in) / Chen, R.T. (Autor:in)


    Erscheinungsdatum :

    2004-01-01


    Format / Umfang :

    183847 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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