Current excimer-laser processing techniques can be extended to a broader and more diverse range of materials by moving to the vacuum ultraviolet (VUV; 100-200 nm) spectral region. Most materials are highly opaque in the VUV and the harder photon energy readily breaks chemical bonds, minimizing thermal loading at target surfaces. Further, the short-wavelength radiation affords patterning of sub quarter-micron feature sizes. An experimental survey has been undertaken to evaluate laser etch rates and surface quality produced on several polymer, glass, and semiconductor materials by both ArF and F/sub 2/ excimer lasers, with the hope of defining new processing applications. A summary of this investigation is presented in this paper.<>


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Vacuum ultraviolet laser ablation of insulators and III-V semiconductors


    Contributors:
    Herman, P.R. (author) / Beckley, K. (author) / Moore, J.D. (author) / Potyrailo, R.A. (author)

    Published in:

    Publication date :

    1993-01-01


    Size :

    227004 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Vacuum Ultraviolet Laser Ablation of Insulators and III-V Semiconductors

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1993


    Ultraviolet and Vacuum-Ultraviolet Laser Ablation of Organic Polymers

    Nakata, T. / Kannari, F. / Obara, M. | British Library Online Contents | 1993



    Investigation of clusters of layered semiconductors prepared by laser ablation

    Galak, M. / Yeschenko, O. / Dmitruk, I. et al. | IEEE | 2005


    Influence of Ablation on Vacuum-Ultraviolet Radiation in a Plasma Wind Tunnel Flow

    Hermann, Tobias / Löhle, Stefan / Fasoulas, Stefanos et al. | AIAA | 2017