Current excimer-laser processing techniques can be extended to a broader and more diverse range of materials by moving to the vacuum ultraviolet (VUV; 100-200 nm) spectral region. Most materials are highly opaque in the VUV and the harder photon energy readily breaks chemical bonds, minimizing thermal loading at target surfaces. Further, the short-wavelength radiation affords patterning of sub quarter-micron feature sizes. An experimental survey has been undertaken to evaluate laser etch rates and surface quality produced on several polymer, glass, and semiconductor materials by both ArF and F/sub 2/ excimer lasers, with the hope of defining new processing applications. A summary of this investigation is presented in this paper.<>


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    Titel :

    Vacuum ultraviolet laser ablation of insulators and III-V semiconductors


    Beteiligte:
    Herman, P.R. (Autor:in) / Beckley, K. (Autor:in) / Moore, J.D. (Autor:in) / Potyrailo, R.A. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.01.1993


    Format / Umfang :

    227004 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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