Summary form only given. A parallel, 32 channel, high density (140 /spl mu/m pitch) 500 Mbps/channel NRZ optical data link has been successfully fabricated using existing GaAs IC, silicon optical bench, and multichip module technologies. Packaging designs, its implementation, and link characterization will be discussed.


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    Title :

    Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC)


    Contributors:
    Wong, Y.M. (author) / Muehlner, D.J. (author) / Faudskar, C.C. (author) / Parzygnat, W.J. (author) / Tyrone, B.H. (author) / Gates, J.V. (author) / Anthony, P.J. (author)

    Published in:

    Proceedings of LEOS'94 ; 1 ; 221 vol.1


    Publication date :

    1994-01-01


    Size :

    28653 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




    The Optoelectronics Technology Consortium (OETC) - Program Update

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1993




    Consortium for Optical and Optoelectronic Technologies for Computing

    IEEE; Lasers and Electro-Optics Society / IEEE; Components, Hybrids and Manufacturing Technology Society | British Library Conference Proceedings | 1993