Summary form only given. A parallel, 32 channel, high density (140 /spl mu/m pitch) 500 Mbps/channel NRZ optical data link has been successfully fabricated using existing GaAs IC, silicon optical bench, and multichip module technologies. Packaging designs, its implementation, and link characterization will be discussed.
Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC)
Proceedings of LEOS'94 ; 1 ; 221 vol.1
01.01.1994
28653 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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|Optoelectronic Technology Consortium (OETC)
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