The 3D-OESP Consortium is a government-industry-university collaboration dedicated to the development of the technologies required to integrate stacked silicon chips with optoelectronic devices for high-performance computing and switching applications.
Packaging optoelectronic stacked processors and free-space optical interconnects
1999-01-01
219055 byte
Conference paper
Electronic Resource
English
Packaging Optoelectronic Stacked Processors and Free-Space Optical Interconnects
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