Aeroflex Colorado Springs has developed a 16Mbit multi-chip module (MCM) SRAM operating on a single 5V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print configuration. Conventional aluminum wire bonding has been used to optimize the reliability of this packaging technique.
RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip Module
2007-03-01
321349 byte
Conference paper
Electronic Resource
English
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