Aeroflex Colorado Springs has developed a 16Mbit multi-chip module (MCM) SRAM operating on a single 5V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print configuration. Conventional aluminum wire bonding has been used to optimize the reliability of this packaging technique.


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    Titel :

    RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip Module


    Beteiligte:
    Hafer, Craig (Autor:in) / Mabra, Jonathan (Autor:in) / Slocum, Duane (Autor:in) / Thorne, Sean (Autor:in)


    Erscheinungsdatum :

    2007-03-01


    Format / Umfang :

    321349 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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