Backside wafer processing has been developed for discrete beamlead diodes and beamlead MMICs. Backside etching allows arbitrary substrate geometry. The beamleads are used to make electrical connections to a waveguide block and/or serve as substrateless transmission lines. The fabrication of an 82.5 to 330 GHz MMIC balanced frequency quadrupler is presented.


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    Title :

    Novel fabrication of integrated submillimeter circuits


    Contributors:
    Nye, K.W. (author) / Qun Xiao, (author) / Hesler, J.L. (author) / Crowe, T.W. (author)


    Publication date :

    2002-01-01


    Size :

    331202 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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