Backside wafer processing has been developed for discrete beamlead diodes and beamlead MMICs. Backside etching allows arbitrary substrate geometry. The beamleads are used to make electrical connections to a waveguide block and/or serve as substrateless transmission lines. The fabrication of an 82.5 to 330 GHz MMIC balanced frequency quadrupler is presented.
Novel fabrication of integrated submillimeter circuits
2002-01-01
331202 byte
Conference paper
Electronic Resource
English
Novel Fabrication of Integrated Submillimeter Circuits
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