Backside wafer processing has been developed for discrete beamlead diodes and beamlead MMICs. Backside etching allows arbitrary substrate geometry. The beamleads are used to make electrical connections to a waveguide block and/or serve as substrateless transmission lines. The fabrication of an 82.5 to 330 GHz MMIC balanced frequency quadrupler is presented.


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    Titel :

    Novel fabrication of integrated submillimeter circuits


    Beteiligte:
    Nye, K.W. (Autor:in) / Qun Xiao, (Autor:in) / Hesler, J.L. (Autor:in) / Crowe, T.W. (Autor:in)


    Erscheinungsdatum :

    01.01.2002


    Format / Umfang :

    331202 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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