This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various satellites, eliminating the concern associated with potential particulates from integration and test or the launch environment. Protection of this MEMS based thermal device is achieved using a novel polymer that is both IR transmissive and electrically conductive. This polymer was originally developed and qualified for space flight application by NASA at the Langley Research Center. The polymer material, commercially known as CP1, is coated with a thin layer of ITO and sandwiched between two window-like frames. The packaging of the MEMS based radiator assembly offers the benefits of micro-scale devices in a chip on board fashion, with the level of protection generally found in packaged parts.
Novel micro electro mechanical systems (MEMS) packaging for the skin of the satellite
2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) ; 4 ; 2486-2494 Vol.4
2004-01-01
650995 byte
Conference paper
Electronic Resource
English
7.0903 Novel Micro Electro Mechanical Systems (MEMS) Packaging for the Skin of the Satellite
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