This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various satellites, eliminating the concern associated with potential particulates from integration and test or the launch environment. Protection of this MEMS based thermal device is achieved using a novel polymer that is both IR transmissive and electrically conductive. This polymer was originally developed and qualified for space flight application by NASA at the Langley Research Center. The polymer material, commercially known as CP1, is coated with a thin layer of ITO and sandwiched between two window-like frames. The packaging of the MEMS based radiator assembly offers the benefits of micro-scale devices in a chip on board fashion, with the level of protection generally found in packaged parts.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Novel micro electro mechanical systems (MEMS) packaging for the skin of the satellite


    Beteiligte:
    Darrin, M.A. (Autor:in) / Osiander, R. (Autor:in) / Lehtonen, J. (Autor:in) / Farrar, D. (Autor:in) / Douglas, D. (Autor:in) / Swanson, T. (Autor:in)


    Erscheinungsdatum :

    01.01.2004


    Format / Umfang :

    650995 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch