Summary form only given. Due to their dimensional compatibility 3-D memories and 3-D packaged electronic processing systems may be naturally well suited to each others needs. For example, 3-D electronic processing systems can provide high speed data compression, decompression, error correction, cache memory and various database functions needed for 3-D optical storage systems. On the other hand, 3-D optical storage systems may well provide the compact high bandwidth secondary storage system solutions that 3-D packaged image processing systems may need. This talk will explore these possibilities and will attempt to outline means by which these devices can be interfaced advantageously.


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    Title :

    Optical memory systems for 3-D computing architectures


    Contributors:
    Esener, S. (author)


    Publication date :

    1995-01-01


    Size :

    108930 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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