Summary form only given. Due to their dimensional compatibility 3-D memories and 3-D packaged electronic processing systems may be naturally well suited to each others needs. For example, 3-D electronic processing systems can provide high speed data compression, decompression, error correction, cache memory and various database functions needed for 3-D optical storage systems. On the other hand, 3-D optical storage systems may well provide the compact high bandwidth secondary storage system solutions that 3-D packaged image processing systems may need. This talk will explore these possibilities and will attempt to outline means by which these devices can be interfaced advantageously.


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    Titel :

    Optical memory systems for 3-D computing architectures


    Beteiligte:
    Esener, S. (Autor:in)


    Erscheinungsdatum :

    01.01.1995


    Format / Umfang :

    108930 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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