A planar lightwave circuit (PLC) based optoelectronic packaging platform is described. Features include completely passive, performance-insensitive alignment for all devices to +/- 2 microns, glob-top encapsulation to eliminate hermetic packaging and wafer-level test and burn-in.
Surface mount photonics as a platform for optoelectronic packaging
2003-01-01
197348 byte
Conference paper
Electronic Resource
English
Surface Mount Photonics as a Platform for Optoelectronic Packaging
British Library Conference Proceedings | 2003
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