A planar lightwave circuit (PLC) based optoelectronic packaging platform is described. Features include completely passive, performance-insensitive alignment for all devices to +/- 2 microns, glob-top encapsulation to eliminate hermetic packaging and wafer-level test and burn-in.


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    Title :

    Surface mount photonics as a platform for optoelectronic packaging


    Contributors:


    Publication date :

    2003-01-01


    Size :

    197348 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English