A planar lightwave circuit (PLC) based optoelectronic packaging platform is described. Features include completely passive, performance-insensitive alignment for all devices to +/- 2 microns, glob-top encapsulation to eliminate hermetic packaging and wafer-level test and burn-in.
Surface mount photonics as a platform for optoelectronic packaging
01.01.2003
197348 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Surface Mount Photonics as a Platform for Optoelectronic Packaging
British Library Conference Proceedings | 2003
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British Library Online Contents | 2004
Online Contents | 1997
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