We propose a novel modular integrated structure to improve the fabrication yield and reliability of planar lightwave circuit (PLC) hybrid-integrated modules. As a key component, we have developed a chip-scale packaging technique for opto-electronic (OE-) devices, and successfully fabricated a 1.3/1.49/1.55-/spl mu/m optical WDM transceiver module.


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    Title :

    PLC-based WDM transceiver with modular structure using chip-scale-packaged OE-devices


    Contributors:
    Nakanishi, Y. (author) / Hirota, H. (author) / Watanabe, K. (author) / Hashizume, Y. (author) / Ogawa, I. (author) / Ishii, M. (author) / Kohtoku, M. (author) / Yanagisawa, M. (author) / Endo, J. (author) / Kurosaki, T. (author)


    Publication date :

    2005-01-01


    Size :

    653166 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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