An assembly. In some embodiments, the assembly includes: a photonic integrated circuit (PIC, 105); and an electronic integrated circuit (IC, 110). A front surface of the photonic integrated circuit abuts, in an area of overlap (135), against a front surface of the electronic integrated circuit. A first portion (125) of the photonic integrated circuit overhangs a first edge (130) of the electronic integrated circuit, and a first portion (115) of the electronic integrated circuit overhangs a first edge (120) of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.
Co-packaged optics and transceiver
2022-01-05
Patent
Electronic Resource
English
PLC-based WDM Transceiver with Modular Structure using Chip-Scale-Packaged OE-Devices
British Library Conference Proceedings | 2005
|FIBER OPTICS: Optical transceiver goes where copper cannot
British Library Online Contents | 2007
British Library Conference Proceedings | 2005
|