Optoelectronic bonding has been performed onto sample MCMs (multi-chip modules), which are to be used for optical testing for the high-speed optoelectronic memory systems [HOLMS] demonstrator. This was conducted on an FC6 bonder using the flip chip bonding process.


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    Title :

    Solutions to optoelectronic packaging problems


    Contributors:


    Publication date :

    2005-01-01


    Size :

    348960 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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