Optoelectronic bonding has been performed onto sample MCMs (multi-chip modules), which are to be used for optical testing for the high-speed optoelectronic memory systems [HOLMS] demonstrator. This was conducted on an FC6 bonder using the flip chip bonding process.
Solutions to optoelectronic packaging problems
01.01.2005
348960 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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