Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips.


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    Titel :

    Solutions to optoelectronic interconnect problems


    Beteiligte:
    Kumpatla, S. (Autor:in) / Casswell, J. J. (Autor:in) / Snowdon, J. F. (Autor:in)


    Erscheinungsdatum :

    01.06.2005


    Format / Umfang :

    448987 byte



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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