Summary form only given. Non-hermetic, plastic packaging technologies are almost mature for the production of low-cost optical modules. Production of optical modules at low cost is essential in furthering the evolution of optical access networks. Cost-effective plastic packaging technology that incorporates flip-chip mounting developed in the LSI field, is an answer for mass production of optical modules.


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    Title :

    Plastic packaging technologies for low-cost optical modules


    Contributors:
    Tsuji, S. (author) / Tatsuno, K. (author)


    Publication date :

    1998-01-01


    Size :

    148693 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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