Summary form only given. Non-hermetic, plastic packaging technologies are almost mature for the production of low-cost optical modules. Production of optical modules at low cost is essential in furthering the evolution of optical access networks. Cost-effective plastic packaging technology that incorporates flip-chip mounting developed in the LSI field, is an answer for mass production of optical modules.
Plastic packaging technologies for low-cost optical modules
1998-01-01
148693 byte
Conference paper
Electronic Resource
English
Plastic Packaging Technologies for Low-Cost Optical Modules
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