Summary form only given. Non-hermetic, plastic packaging technologies are almost mature for the production of low-cost optical modules. Production of optical modules at low cost is essential in furthering the evolution of optical access networks. Cost-effective plastic packaging technology that incorporates flip-chip mounting developed in the LSI field, is an answer for mass production of optical modules.


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    Titel :

    Plastic packaging technologies for low-cost optical modules


    Beteiligte:
    Tsuji, S. (Autor:in) / Tatsuno, K. (Autor:in)


    Erscheinungsdatum :

    01.01.1998


    Format / Umfang :

    148693 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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