To meet various technical challenges for optical interconnects for a bandwidth-demanding backplane, we are studying various approaches to construct parallel optical interconnect channels, interfaciable with 2D arrays of VCSEL's and receivers. We summarize our recent progresses in back-plane level optical parallel interconnect technologies based on guided-wave and hybrid (free-space/guided-wave) packaging methods. A PMMA polymer fiber-image-guide (PFIG) optical 2D parallel interconnect system has been proposed and demonstrated. Both a point-to-point and a more generalized circuit were studied. The underlining system concepts were demonstrated by an embedded prototype board and surface-mounted packaging.


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    Title :

    Fully packaged guided-wave and hybrid optical circuits for future photonic backplanes


    Contributors:
    Li, Y. (author) / Ai, J. (author)


    Publication date :

    1999-01-01


    Size :

    249867 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




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