To meet various technical challenges for optical interconnects for a bandwidth-demanding backplane, we are studying various approaches to construct parallel optical interconnect channels, interfaciable with 2D arrays of VCSEL's and receivers. We summarize our recent progresses in back-plane level optical parallel interconnect technologies based on guided-wave and hybrid (free-space/guided-wave) packaging methods. A PMMA polymer fiber-image-guide (PFIG) optical 2D parallel interconnect system has been proposed and demonstrated. Both a point-to-point and a more generalized circuit were studied. The underlining system concepts were demonstrated by an embedded prototype board and surface-mounted packaging.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Fully packaged guided-wave and hybrid optical circuits for future photonic backplanes


    Beteiligte:
    Li, Y. (Autor:in) / Ai, J. (Autor:in)


    Erscheinungsdatum :

    01.01.1999


    Format / Umfang :

    249867 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




    Intelligent optical backplanes

    Szymanski, T. | British Library Conference Proceedings | 1995


    Progress in Free-Space Optical Backplanes

    IEEE / Lasers and Electro-Optics Society | British Library Conference Proceedings | 1995


    Progress in free space optical backplanes

    Plant, D.V. / Hinton, H.S. | IEEE | 1995


    Ultra Fabrication-Tolerant Fully Packaged Micro-Optical Polarization Diversity Hybrid

    Pennings, E. C. M. / Schouten, D. / Khoe, G.-D. et al. | British Library Online Contents | 1995