A semi-automated die bonder that nests and bond chips in has been fabricated. The design for the die bonder incorporates wafer-scale die bonding, small volume stack-up bonding, vacuum soldering and/or individual die bonding capabilities - which is unique to any die bonders or patents made/held to date.


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    Title :

    The design for an innovative semi-automatic die bonder


    Contributors:
    Matthews, K. (author) / Cady, R. (author) / Kelley, M. (author) / Doig, A. (author) / Sidebottom, N. (author) / Knowles, P. (author) / Sylvester, J. (author) / Husted, A. (author) / Albee, P. (author) / Songsheng Tan, (author)


    Publication date :

    2004-01-01


    Size :

    98332 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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