A semi-automated die bonder that nests and bond chips in has been fabricated. The design for the die bonder incorporates wafer-scale die bonding, small volume stack-up bonding, vacuum soldering and/or individual die bonding capabilities - which is unique to any die bonders or patents made/held to date.
The design for an innovative semi-automatic die bonder
2004-01-01
98332 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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