Some of the design, inspection, and test trade-offs involved in creating modern high-performance multichip modules (MCMs) for both military and high-end commercial applications with an adverse environment are covered. Design features and qualification tests are discussed. Some more cost-effective MCM testing possibilities are examined.<>
Multi-chip modules for military and adverse environment applications
IEEE Aerospace and Electronic Systems Magazine ; 8 , 9 ; 17-19
1993-09-01
318342 byte
Article (Journal)
Electronic Resource
English
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