Some of the design, inspection, and test trade-offs involved in creating modern high-performance multichip modules (MCMs) for both military and high-end commercial applications with an adverse environment are covered. Design features and qualification tests are discussed. Some more cost-effective MCM testing possibilities are examined.<>


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    Title :

    Multi-chip modules for military and adverse environment applications


    Contributors:
    Port, R.M. (author)


    Publication date :

    1993-09-01


    Size :

    318342 byte




    Type of media :

    Article (Journal)


    Type of material :

    Electronic Resource


    Language :

    English



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