Some of the design, inspection, and test trade-offs involved in creating modern high-performance multichip modules (MCMs) for both military and high-end commercial applications with an adverse environment are covered. Design features and qualification tests are discussed. Some more cost-effective MCM testing possibilities are examined.<>
Multi-chip modules for military and adverse environment applications
IEEE Aerospace and Electronic Systems Magazine ; 8 , 9 ; 17-19
01.09.1993
318342 byte
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch
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