Some of the design, inspection, and test trade-offs involved in creating modern high-performance multichip modules (MCMs) for both military and high-end commercial applications with an adverse environment are covered. Design features and qualification tests are discussed. Some more cost-effective MCM testing possibilities are examined.<>


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    Titel :

    Multi-chip modules for military and adverse environment applications


    Beteiligte:
    Port, R.M. (Autor:in)


    Erscheinungsdatum :

    1993-09-01


    Format / Umfang :

    318342 byte




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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