Summary form only given. We focus on a simpler discharge geometry that is more amenable to mass production. These devices consist of a Si cathode, a pyrex dielectric layer, and a Ni anode and differ from those previously reported in that the cathode is a plane rather than a cylinder. The devices are fabricated by drilling a hole in the pyrex using ultrasonic milling, anodically bonding the pyrex onto a silicon substrate, and then depositing the nickel anode.
Characteristics of microdischarge devices in silicon
1998-01-01
87493 byte
Conference paper
Electronic Resource
English
Characteristics of Microdischarge Devices in Silicon
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