Summary form only given. We focus on a simpler discharge geometry that is more amenable to mass production. These devices consist of a Si cathode, a pyrex dielectric layer, and a Ni anode and differ from those previously reported in that the cathode is a plane rather than a cylinder. The devices are fabricated by drilling a hole in the pyrex using ultrasonic milling, anodically bonding the pyrex onto a silicon substrate, and then depositing the nickel anode.


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    Title :

    Characteristics of microdischarge devices in silicon


    Contributors:
    Frame, J.W. (author) / John, P.C. (author) / Bozeman, B. (author) / Wheeler, D.J. (author) / Eden, J.G. (author) / DeTemple, T.A. (author)


    Publication date :

    1998-01-01


    Size :

    87493 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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