The temperature effects on thermal resistance measurement of power modules when applying the transient dual interface measurement method proposed in JESD51-14 is studied in this paper. Simulation and experiment results indicate that the junction temperature should be consistent of two transient cooling curves with and without thermal grease, otherwise the two thermal impedance curves will separate prematurely that result in a lower valuation even an incorrect one of junction-to-case thermal resistance, which is especially obvious for Insulated Gate Bipolar Transistor (IGBT).


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    Title :

    Temperature effects on the transient measurement of the junction-to-case thermal resistance of IGBTs


    Contributors:
    Zhijie Qiu, (author) / Jin Zhang, (author) / Jinlei Meng, (author) / Xuhui Wen, (author)


    Publication date :

    2014-08-01


    Size :

    400188 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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