By matching the emission spot size of the semiconductor device to that of a singlemode fibre the packaging processes become much simpler. Results from large spot semiconductor amplifiers which can be assembled in conventional or low cost passive configurations have been reported. These devices have both the performance and, in the passively aligned package the very low cost needed to dramatically affect the architecture of future telecommunication networks.


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    Title :

    The packaging of large spot-size semiconductor optical amplifiers


    Contributors:
    Collins, J.V. (author) / Kelly, A. (author) / Ford, C.W. (author) / Lealman, I.F. (author)


    Publication date :

    1997-01-01


    Size :

    234792 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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