By matching the emission spot size of the semiconductor device to that of a singlemode fibre the packaging processes become much simpler. Results from large spot semiconductor amplifiers which can be assembled in conventional or low cost passive configurations have been reported. These devices have both the performance and, in the passively aligned package the very low cost needed to dramatically affect the architecture of future telecommunication networks.


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    Titel :

    The packaging of large spot-size semiconductor optical amplifiers


    Beteiligte:
    Collins, J.V. (Autor:in) / Kelly, A. (Autor:in) / Ford, C.W. (Autor:in) / Lealman, I.F. (Autor:in)


    Erscheinungsdatum :

    01.01.1997


    Format / Umfang :

    234792 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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