This study demonstrates the stacking of a GaAs-based thin film emitter directly on top of a InGaAs-based thin film photodetector which is integrated directly onto a Si CMOS transceiver circuit. This is the first demonstration of a mixed material 3D thin film device stack and a 3D device stack integrated onto a Si CMOS integrated circuit.
Single fiber bi-directional links using 3D stacked thin film emitters and detectors integrated onto CMOS transceiver circuits
Conference on Lasers and Electro-Optics, 2004. (CLEO). ; 2 ; 2 pp. vol.2
2004-01-01
233827 byte
Conference paper
Electronic Resource
English
Integration of InP-based thin-film emitters and detectors onto a single silicon circuit
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