This study demonstrates the stacking of a GaAs-based thin film emitter directly on top of a InGaAs-based thin film photodetector which is integrated directly onto a Si CMOS transceiver circuit. This is the first demonstration of a mixed material 3D thin film device stack and a 3D device stack integrated onto a Si CMOS integrated circuit.


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    Title :

    Single fiber bi-directional links using 3D stacked thin film emitters and detectors integrated onto CMOS transceiver circuits


    Contributors:
    Geddis, D.L. (author) / Hyun, S.H. (author) / Chang, J. (author) / Jung, S. (author) / Brooke, M.A. (author) / Jokerst, N.M. (author)


    Publication date :

    2004-01-01


    Size :

    233827 byte



    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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