This study demonstrates the stacking of a GaAs-based thin film emitter directly on top of a InGaAs-based thin film photodetector which is integrated directly onto a Si CMOS transceiver circuit. This is the first demonstration of a mixed material 3D thin film device stack and a 3D device stack integrated onto a Si CMOS integrated circuit.


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    Titel :

    Single fiber bi-directional links using 3D stacked thin film emitters and detectors integrated onto CMOS transceiver circuits


    Beteiligte:
    Geddis, D.L. (Autor:in) / Hyun, S.H. (Autor:in) / Chang, J. (Autor:in) / Jung, S. (Autor:in) / Brooke, M.A. (Autor:in) / Jokerst, N.M. (Autor:in)


    Erscheinungsdatum :

    01.01.2004


    Format / Umfang :

    233827 byte



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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