A structural module assembly with conductive reinforcements overmolded within the plastic and/or composite subassembly as a main power bus and a communication bus for electrical components assembled onto the module. Control signals are either transmitted between a main microcontroller and another microcontroller by way of the communication bus or wirelessly. The microcontrollers determine which electrical components to activate, and power is provided to the electrical components by way of the main power bus.

    L'invention concerne un ensemble modulaire structural muni de renforcements conducteurs surmoulés à l'intérieur du sous-ensemble plastique et/ou composite comme un bus d'alimentation principal et un bus de communication destinés à des composants électriques assemblés sur le module. Des signaux de commande sont soit transmis entre un microcontrôleur principal et un autre microcontrôleur au moyen du bus de communication ou sans fil. Les microcontrôleurs déterminent quels composants électriques doivent être activés, et de l'énergie est fournie aux composants électriques au moyen du bus d'alimentation principal.


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    Title :

    STRUCTURAL MODULE ASSEMBLY HAVING OVERMOLDED ELECTRICALLY CONDUCTIVE REINFORCEMENTS


    Additional title:

    ENSEMBLE MODULAIRE STRUCTURAL COMPRENANT DES RENFORCEMENTS ÉLECTROCONDUCTEURS SURMOULÉS


    Contributors:

    Publication date :

    2017-07-20


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / B62D MOTOR VEHICLES , Motorfahrzeuge



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