Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.
DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES
2025-05-29
Patent
Electronic Resource
English
IPC: | H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H01R Elektrisch leitende Verbindungen , ELECTRICALLY-CONDUCTIVE CONNECTIONS / H02G INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES , Verlegen oder Installieren elektrischer Kabel oder Leitungen, Verlegen oder Installieren kombinierter optischer und elektrischer Kabel oder Leitungen / H05K PRINTED CIRCUITS , Gedruckte Schaltungen |
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