Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.


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    Title :

    DESIGN AND PACKAGING OF WIDE BANDGAP POWER ELECTRONIC POWER STAGES


    Contributors:

    Publication date :

    2023-01-26


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / B60K Anordnung oder Einbau von Antriebseinheiten oder von Kraft- bzw. Drehmomentübertragungen in Fahrzeugen , ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H01R Elektrisch leitende Verbindungen , ELECTRICALLY-CONDUCTIVE CONNECTIONS / H02G INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES , Verlegen oder Installieren elektrischer Kabel oder Leitungen, Verlegen oder Installieren kombinierter optischer und elektrischer Kabel oder Leitungen / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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