A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land includes a first region and a second region. The first region is a regions to which the electronic component is bonded. The second region is a region protruding from a part of a peripheral edge portion of the first region in a direction in which the first region is extended in plan view.
SOLDER MOUNTING LAND AND CHARGER
2024-08-08
Patent
Electronic Resource
English
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