A solder mounting land according to the present disclosure is a land on which an electronic component is to be disposed via solder and the electronic component is to be mounted by soldering. The solder mounting land includes a first region and a second region. The first region is a regions to which the electronic component is bonded. The second region is a region protruding from a part of a peripheral edge portion of the first region in a direction in which the first region is extended in plan view.


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    Titel :

    SOLDER MOUNTING LAND AND CHARGER


    Beteiligte:
    HOSOI HIROYUKI (Autor:in)

    Erscheinungsdatum :

    08.08.2024


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen



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