A semiconductor module comprises a semiconductor apparatus and a cooling apparatus. The semiconductor apparatus includes a semiconductor chip and a circuit board. The cooling apparatus includes: a top plate; a side wall; a bottom plate; a coolant flow portion for causing a coolant to flow defined by the plates and the wall, where a cross section of the portion parallel to a principal surface of the top plate have a substantially rectangular shape with longer sides and shorter sides; an inlet associated with one direction along the shorter sides for letting a coolant into the portion; an outlet associated with another direction along the shorter sides for letting a coolant out of the portion; and a cooling pin fin arranged in the portion, extending between the top plate and the bottom plate, and having a substantially rhombic shape longer along the shorter sides than along the longer sides.
SEMICONDUCTOR MODULE, VEHICLE AND MANUFACTURING METHOD
2020-05-28
Patent
Electronic Resource
English
IPC: | H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS , Anlagen zur Umformung von Wechselstrom in Wechselstrom, von Wechselstrom in Gleichstrom oder umgekehrt, oder von Gleichstrom in Gleichstrom und zur Verwendung in Netzen oder ähnlichen Stromversorgungssystemen |
COOLER, SEMICONDUCTOR MODULE, VEHICLE AND MANUFACTURING METHOD
European Patent Office | 2019
|European Patent Office | 2024
|European Patent Office | 2019
|European Patent Office | 2016
|