A microphone assembly includes a printed circuit board that defines a tab that is configured to extend into an opening defined by a substrate layer of a headliner. The microphone assembly includes a microphone element mounted on the tab. The microphone assembly includes a sealing element that surrounds the tab and the microphone element and is configured to fill the opening and define an air path from a cabin side of the substrate layer to the printed circuit board or the microphone element.


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    Title :

    INVISIBLE HEADLINER MICROPHONE



    Publication date :

    2020-05-07


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H04R LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS , Lautsprecher, Mikrofone, Schallplatten-Tonabnehmer oder ähnliche akustische, elektromechanische Wandler / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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